Team:Electronics/Risk Assessments/Reflow Soldering: Revision history

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11 February 2025

  • curprev 21:3721:37, 11 February 2025‎ Asj talk contribs‎ 2,411 bytes +2,411‎ Created page with "{{RiskAssessment |name = Reflow Soldering |assessmentType = Activity |reviewed = 2025-02-11 |nextReview = 2026-02-11 |notes = The reflow oven can be used for soldering (and re-soldering) entire circuit boards through a temperature controlled cycle. |risk_1 = '''Minor Burns''' due to accidental skin contact with the oven interior. |mitigation_1 = The reflow oven will not stay on for more than two minutes, and should cool down fairl..."
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