Difference between revisions of "User:Asj/Notes about laser cutting solder stencils"
< User:Asj
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(Created page with "Most pads are ok - perhaps a bit large. Small pitch QFN packages are a problem. To do these, * For each QFN pad, downsize "solder paste absolute clearance" to -0.09 and prod...") |
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Most pads are ok - perhaps a bit large. | Most pads are ok - perhaps a bit large. | ||
− | + | * Change the pad clearance in Lightburn | |
− | + | ** File -> Board Setup -> Solder Mask Paste | |
− | * | + | ** "Solder paste absolute clearance" -> -0.09mm |
* Configure Light burn to engrave at | * Configure Light burn to engrave at | ||
− | ** 100mm/s at | + | ** 100mm/s at 28% |
** Line interval of 0.02mm | ** Line interval of 0.02mm | ||
+ | |||
+ | I like to soak a piece of paper in water and put it below the mylar. This helps reduce burning and warping |
Latest revision as of 21:29, 20 May 2024
Most pads are ok - perhaps a bit large.
- Change the pad clearance in Lightburn
- File -> Board Setup -> Solder Mask Paste
- "Solder paste absolute clearance" -> -0.09mm
- Configure Light burn to engrave at
- 100mm/s at 28%
- Line interval of 0.02mm
I like to soak a piece of paper in water and put it below the mylar. This helps reduce burning and warping