Team:Electronics/Risk Assessments/Hot Air Rework: Revision history

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28 March 2025

  • curprev 23:3023:30, 28 March 2025‎ Asj talk contribs‎ m 2,231 bytes −2‎ Correct risk assessment name
  • curprev 22:5722:57, 28 March 2025‎ Asj talk contribs‎ 2,233 bytes +2,233‎ Created page with "{{RiskAssessment |name = Reflow Soldering |assessmentType = Activity |reviewed = 2025-03-28 |nextReview = 2026-03-28 |notes = Hot air rework involves using a temperature controlled hot air gun to lift or resolder surface mount components. |risk_1 = '''Minor Burns''' due to coming into contact with a heated board or the end of the hot air nozzle. |mitigation_1 = The hot air rework station has a cradle for securely holding the "gun"..."
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